lite-on dcc release lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto through hole lamp product data sheetLTL1BESTBKJH185P spec no.: ds20-2014-0222effective date: 11/26/2016revision: a bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4
1 / 9 part no. : LTL1BESTBKJH185P bns - od - fc002/a4 through hole lamp LTL1BESTBKJH185P through hole lamp LTL1BESTBKJH185P rev description by date p 0 01 preliminary new specification (rdr - 20141187 - 01) pitak m. 10/02 /2014 above data for pd and customer tracking only - new specification upload on opnc chalerm ya. 12/19/2014 a update bin table of blue iv javy h. 09/26/2016
2 / 9 part no. : LTL1BESTBKJH185P bns - od - fc002/a4 through hole lamp LTL1BESTBKJH185P 1. description cbi (circuit board indicator) is a black plastic right angle holder (housing) which mates with lite - on led lamps. lite - on cbi is available in a wi de variety of packages, including top - view (spacer) or right angle an d horizontal or vertical arrays which is s tackable and easy to assembly. 1 . 1. features ? designed for ease in circuit board assembly . ? black case enhance contrast ratio. ? halogen free produ ct (cl<900 ppm, br<900 ppm, and cl +br<1500 ppm). ? low power consumption . ? lead free product & rohs compliant . ? t - 1 lamp: source bi - c olors are ingan blue/alingap yellow with white diffused l ens . 1.2 . applications ? communication . ? computer . ? consumer . ? industria l . 2 . outline dimensions notes : 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25mm (.010") unless otherwise noted. 3. the holder (housing) material is plastic black. 4. led lamp is blue/yellow with white diffused lens. 5. specifications are subject to change without notice.
3 / 9 part no. : LTL1BESTBKJH185P bns - od - fc002/a4 through hole lamp LTL1BESTBKJH185P 3. absolute maximum ratings at ta = 25 c parameter blue yellow unit power dissipation 123 75 mw peak forward current (duty cycle Q 1/10, pulse width Q 10ms) 60 60 ma dc forward current 30 30 ma operating temperature range - 4 0c to + 85c storage temperature range - 40c to + 100c lead soldering temperature [2.0mm (.079") from body] 260c for 5 seconds max. 4. electrical / optical characteristics at ta=25 c parameter symbol color min. typ. max. unit test condition radiant intensity iv blue yellow 1 8 0 1 40 520 380 88 0 680 mcd if = 20ma note 1, 4 viewing angle 21/2 blue yellow 40 40 deg note 2 (fig.6) peak emission wavele ngth p blue yellow 468 591 nm measurement @peak (fig.1) dominant wavelength d blue yellow 464 582 470 589 475 5 96 nm if = 20ma , note 3 spectral line half - width ? blue yellow 22 20 nm forward voltage vf blue yellow 3.2 2.1 4.0 2. 5 v i f = 20ma reverse current ir blue yellow 10 a vr = 5v note 6 note: 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie eye - response curve. 2. 1/2 is the off - axis angle at which the luminous inte nsity is half the axial luminous intensity. 3 . the dominant wavelength, d is derived from the cie chromaticity diagram and represents the single wavelength which defines the color of the device. 4 . iv gua rantee must be included with 30 % testing toleranc e. 5. reverse current is controlled by dice source. 6 . reverse voltage (vr) condition is applied for ir test only. the device is not designed for reverse operation.
4 / 9 part no. : LTL1BESTBKJH185P bns - od - fc002/a4 through hole lamp LTL1BESTBKJH185P 5. typical electrical / optical characteristics curves (25 c ambient temperature unless oth erwise noted)
5 / 9 part no. : LTL1BESTBKJH185P bns - od - fc002/a4 through hole lamp LTL1BESTBKJH185P 6 . packing spec ification 300 , 200 or 100 pcs per packing bag 11 packing bags per inner carton t otal 3 , 3 00 pcs per inner carton 8 inner cartons per outer carton t otal 26,400 pcs per outer cart on in every shipping lot, only the last pack will be non - full packing
6 / 9 part no. : LTL1BESTBKJH185P bns - od - fc002/a4 through hole lamp LTL1BESTBKJH185P 7 . bin table specification iv bin code luminous intensity ( blue ) unit : mcd @ 20 ma iv bin code luminous intensity ( yellow ) unit : mcd @ 20 ma min. max. min. max. hj 180 310 gh 140 240 kl 310 520 jk 240 400 mn 520 880 lm 400 680 note: tolerance of each bin limit is 30 % hue bin code dominant wavelength ( blue ) unit : nm @20ma hue bin code dominant wavelength ( yellow ) unit : nm @20ma min. max. min. max. 1 46 4.0 47 0. 0 3 582.0 0 589.0 2 470.0 475.0 4 589.0 596.0 note: tolerance of each bin limit is 1 nm bin code list. category code fg 1 ef 3 luminous intensity (blue) dominant wavelength (blue) luminous intensity (yellow) dominant wavelength (yellow)
7 / 9 part no. : LTL1BESTBKJH185P bns - od - fc002/a4 through hole lamp LTL1BESTBKJH185P 8 . cauti ons 8 . 1. application this led lamp is good for application of indoor and outdoor sign, also ordinary electronic equipment. 8 . 2. storage the storage ambient for the leds should not exceed 30c temperature or 70% relative humidity. it is recommended that l eds out of their original packaging are used within three months. for extended storage out of their original packaging, it is recommended that the leds be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 8 . 3. cleaning use alcohol - based cleaning solvents such as isopropyl alcohol to clean the leds if necessary. 8 . 4. lead forming & assembly during lead forming, the leads should be bent at a point at least 3mm from the base of led lens. do not use the base of t he lead frame as a fulcrum during forming. lead forming must be done before soldering, at normal temperature. during assembly on pcb, use minimum clinch force possible to avoid excessive mechanical stress. 8 . 5. soldering when soldering, leave a minim um of 2 mm clearance from the base of the lens to t he soldering point. dipping the lens into the solder must be avoided. do not apply any external stress to the lead frame during sol dering while the led is at high temperature. r ecommended soldering conditions : soldering iron wave soldering temperature soldering time position 350c max. 3 seconds max. (one time only) no closer than 2 mm from the base of the epoxy bulb pre - heat pre - heat time solder wave soldering time dipping posi tion 120 c max. 100 seconds max. 260c max. 5 seconds max. no lower than 2 mm from the base of the epoxy bulb note: excessive soldering temperature and/or time might result in deformation of the led lens or catastrophic failure of the led. ir reflo w is not suitable process for through hole type led lamp product . max temperature of wave soldering is not means that holder s hdt/melting temperature. 8 . 6. drive method an led is a current - operated device. in order to ensure intensity uniformity on multi ple leds connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each led as shown in circuit a below. circuit model ( a ) circuit model ( b ) (a) recommended circuit (b) the brightness of each led might appear different due to the differences in the i - v characteristics of those leds. led led
8 / 9 part no. : LTL1BESTBKJH185P bns - od - fc002/a4 through hole lamp LTL1BESTBKJH185P 8 .7. esd (electrostatic discharge) sta tic electricity or power surge will damage the led. suggestions to prevent esd damage: ? use a conductive wrist band or anti - electrostatic glove when handling these leds ? all devices, equipment, and machinery must be properly grounded ? work tables, storage r acks, etc. should be properly grounded ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic lens as a result of friction between leds during storage and handing suggested checking list : training and certif ication 8 .7. 1 .1 . everyone working in a static - safe area is esd - certified? 8 .7.1. 2. training records kept and re - certification dates monitored? static - safe workstation & work areas 8 .7.2.1 . static - safe workstation or work - areas have esd signs? 8 .7. 2. 2. all surfaces and objects at all static - safe workstation and within 1 ft measure less than 100v? 8 .7.2. 3. all ionizer activated, positioned towards the units? 8 .7.2. 4. each work surface mats grounding is good? personnel grounding 8 .7.3.1 . every person (including visitors) handling esd sensitive (esds) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 8 .7.3.1 . if conductive footwear used, conductive flooring also present where operator stand or walk? 8 .7.3.2 . garments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 8 .7.3.3 . every wrist strap or heel strap/conductive shoes checked daily and result recorded for all dls? 8 .7.3.4 . all wrist strap or heel strap check ers calibration up to date? note: *50v for blue led. device handling 8 .7.4. 1. every esds items identified by eia - 471 labels on item or packaging? 8 .7.4. 2. all esds items completely inside properly closed static - shielding containers wh en not at static - safe workstation? 8 .7.4. 3. no static charge generators (e.g. plastics) inside shielding containers with esds items? 8 .7.4. 4. all flexible conductive and dissipative package materials inspected before reuse or recycle? others 8 .7.5. 1. audit result reported to entity esd control coordinator? 8 .7.5. 2. corrective action from previous audits completed? 8 .7.5. 3. are audit records complete and on file?
9 / 9 part no. : LTL1BESTBKJH185P bns - od - fc002/a4 through hole lamp LTL1BESTBKJH185P 9 . reliability test classification test item test condition sample si ze reference standard endurance test operation life ta = u nder room t emperature if = per datasheet maximum drive current test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1026 (1995) mil - std - 883g:1005 (2006) high temperature high humidity s torage ta = 60 c rh = 90 % test time= 24 0hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 202g:103b (2002) jeita ed - 4701:100 103 (2001) high temperature storage ta= 105 5 c test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1031 (1995) mil - std - 883g:1008 (2006) jeita ed - 4701:200 201 (2001) low temperature storage ta= - 55 5 c test time= 1000hrs 22 pcs (cl=90%; ltpd= 10 %) jeita ed - 4701:200 202 (2001) environmental test temperature cycling 100 c 25 c - 40 c 25 c 30mins 5mins 30mins 5mins 3 0 cycles 22 pcs (cl=90%; ltpd= 10 %) mil - std - 750d:1051 (1995) mil - std - 883g:1010 (2006) jeita ed - 4701:100 105 (2001) jesd22 - a104c (2005) thermal shock 100 5 c - 30 c 5 c 15mins 15mins 3 0 cycles (<20 secs transfer ) 22 pcs (cl=90%; ltp d=10 %) mil - std - 750d:1056 (1995) mil - std - 883g:1011 (2006) mil - std - 202g:107g (2002) jesd22 - a106b (2004) solder resistance t.sol = 260 5 c dwell time= 101 seconds 3mm from the base of the epoxy bulb 11 pcs (cl=90%; ltpd=18.9%) mil - std - 750d:2031(1995) jeita ed - 4701: 300 302 (2001) solderability t. sol = 245 5 c dwell time= 5 0.5 seconds (lead free solder, coverage R 95% of the dipped surface) 11 pcs (cl=90%; ltpd=18.9%) mil - std - 750d:2026 (1995) mil - std - 883g:2003 (2006) mil - std - 202g:208h (2002) ipc/eia j - std - 002 (2004) soldering iron t. sol = 350 5 c dwell time= 3.5 0.5 seconds 11 pcs (cl=90%; ltpd=18.9%) mil - std - 202g:208h (2002) jeita ed - 4701:300 302 (2001) 1 0 . others the appearance and specifications of the product may be modified for improvement, without prior notice.
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